Highly conductive metallic thermal interface compound.

Motherboard connector designed for liquid-cooling pumps.

Hardware managing direct memory transfers between devices and RAM.

Base connecting an integrated circuit to external circuitry.

Flat heat-transfer device using phase-change fluid.

Cable allowing multiple fans to share one header.

Hardware managing interrupt requests from devices.

Packaging method mounting a chip face-down onto a substrate.

Sealed tube transferring heat using evaporation and condensation.

Powered device connecting multiple cooling fans.