Printed circuit board supporting and connecting electronic components.

Hardware managing interrupt requests from devices.

Packaging method mounting a chip face-down onto a substrate.

Sealed tube transferring heat using evaporation and condensation.

Powered device connecting multiple cooling fans.

Hardware managing input/output device communication.

Fine wires connecting semiconductor dies to package leads.

Metal structure that dissipates component heat.

Hardware controlling fan speeds.

Motherboard controller supporting legacy peripheral functions.