Plated hole connecting PCB layers electrically.

Temperature or voltage sensor integrated into a chip.

Component opposing electrical current.

Via passing through multiple PCB layers.

Thermal design power used to describe expected heat/power characteristics.

Low-resistance resistor used for current measurement.

Via connecting an outer layer to an internal layer.

Maximum or monitored junction temperature of a processor.

Circuit maintaining a stable output voltage.

Via connecting internal PCB layers without reaching the surface.