Component distributing heat over a larger surface area.

Fan using ball bearings for rotor support.

Small integrated die combined with other dies in one package.

Metal cover mounted over a processor die.

Fan bearing using a fluid film for smooth rotation.

Processor die containing computational cores.

Thermal interface material improving heat transfer between surfaces.

Circuit providing fan-speed feedback.

Magnetic element that reads or writes platter data.

Circular recording path on a magnetic platter.