Probe measuring temperature near Z-axis hardware.

Rate of change of Z-axis velocity.

Resistance of a Z-axis to deformation.

Conductive plate used to remove heat.

Rate at which Z-axis motion slows.

Structural resistance to unwanted movement.

Component distributing heat across a larger area.

Speed of Z-axis movement.

Degree to which Z-axis surfaces remain parallel.

Material or connection improving heat transfer.