PCB-like package substrate connecting a chip to a board.

Silicon substrate providing dense die-to-die connections.

Substrate connecting multiple semiconductor dies.

Processor die containing computational cores.

Small integrated die combined with other dies in one package.

Processor chiplet handling input/output functions.

Platform Controller Hub.

Collection of controllers supporting motherboard functions.

Traditional chipset component handling CPU, memory, and graphics communication.

Traditional chipset component handling slower peripheral interfaces.