PCB-like package substrate connecting a chip to a board.
PCB-like package substrate connecting a chip to a board.
Silicon substrate providing dense die-to-die connections.
Substrate connecting multiple semiconductor dies.
Processor die containing computational cores.
Small integrated die combined with other dies in one package.
Processor chiplet handling input/output functions.
Collection of controllers supporting motherboard functions.
Traditional chipset component handling CPU, memory, and graphics communication.
Traditional chipset component handling slower peripheral interfaces.
Everything is a system, and every system contains systerms.