hardware system

Array of thin metal fins increasing cooling surface area.

Metal structure that dissipates component heat.

Sealed tube transferring heat using evaporation and condensation.

Flat heat-transfer device using phase-change fluid.

Highly conductive metallic thermal interface compound.

Compressible thermally conductive interface material.

Paste used between a chip and heatsink to improve thermal contact.

Thermal interface material improving heat transfer between surfaces.

Metal cover mounted over a processor die.

Component distributing heat over a larger surface area.