hardware system

Conductive package surface transferring heat to a heatsink.

Traditional package with two parallel rows of pins.

Compact surface-mount integrated-circuit package.

Surface-mount package with leads on four sides.

Package using an array of protruding pins.

Package using flat contact pads rather than pins.

Package using an array of solder balls underneath.

Fine wires connecting semiconductor dies to package leads.

Packaging method mounting a chip face-down onto a substrate.

Base connecting an integrated circuit to external circuitry.