Fan accelerating air outward from its center.

Metal heat spreader covering a CPU die.

Heat pipe made primarily from copper.

Heatsink primarily made from copper.

Thin surface increasing heat-dissipation area.

Flat metal surface transferring heat to a cooler.

Water block designed for CPU cooling.

Sealed liquid-cooling system.

User-assembled liquid-cooling system.

Liquid carrying heat through a cooling loop.

Container storing liquid coolant.

Fitting securing tubing with a compression ring.

Sensor measuring cooling-liquid temperature.

Temperature reported for the CPU package.

Heat transfer through moving fluid or air.

Heat transfer through direct material contact.

Bracket securing a CPU cooling solution.

Rear support plate for CPU cooler mounting.

Motherboard connector for a processor.

Electrical contact between CPU and socket.

Flat conductive area on a processor package.

Physical package containing a processor die.

Small semiconductor die combined into a larger package.

Independent processing unit inside a CPU.

Group of processor cores sharing resources.

Group of related processing cores.

Semiconductor die containing processor circuitry.

Die containing computational circuitry.

Die containing cache memory.

Compression Attached Memory Module.

Delay between read command and available data.

Timing interval used for memory commands.

Memory region containing commands for hardware.

Memory storing shader constants.

Electrical path carrying control signals.

Hardware managing processor cache operations.

Fast memory storing frequently accessed data.