Resistor used to restrict current flow.

MOS transistor used in CMOS circuits.

Package connecting an IC to external circuitry.

Chip-scale package.

Small modular semiconductor die.

Conductive contact area on a CPU package.

Electrical pin used to connect a processor.

Flat electrical contact on a processor.

Base layer connecting CPU die and package contacts.

Protective metal cover over a CPU die.

Temperature measured at a component's case.

Solid component transferring heat to a coolant or heatsink.

Water block designed for processor cooling.

Fitting that mechanically secures cooling tubing.

Liquid used to transport heat.

User-assembled liquid-cooling system.

Plate transferring heat away from a component.

Metal plate contacting the heat source.

Metal surface increasing heat-dissipation area.

Cubic feet per minute; airflow measurement.

Fan moving air outward from its rotating center.

Channel guiding cooling air.

Protective covering around a cable or wire bundle.

Mechanism locking a connector in place.

Hardware preventing cable movement.

Small clip used to secure cables.

Fastener used to bundle cables.

Channel used for routing cables.

Bracket supporting organized cable routing.

Protective ring around a cable opening.

Opening allowing cables to pass through.

Mesh covering used to bundle cables.

Input carrying composite analog video.

Input carrying separated component video signals.

Touch panel detecting changes in capacitance.

Sensor detecting color characteristics.

Microphone using a capacitive sensing element.