Small Outline Integrated Circuit package.

CPU cooler using heatsink and fan airflow.

Fan used to move air through a radiator.

Printed Circuit Board.

Dual In-line Package with two rows of pins.

Large vertical air cooler with fin stacks.

Individual conductive or insulating layer within a circuit board.

Physical package enclosing a semiconductor chip.

Compact cooler designed for space-constrained systems.

Conductive copper pathway on a PCB.