Wafer-level chip-scale package.

Small ball of solder used for electrical connections.

Protective metal cover over a CPU die.

Package-on-package semiconductor assembly.

Raised solder connection on a chip package.

Metal plate distributing processor heat.

Small-outline package for integrated circuits.

System-in-package containing multiple functions.

Flat conductive contact on a package.

Tool designed to remove a CPU heat spreader.