Tool used to distribute thermal paste.

IC controlling power-supply operation.

Condition where intake airflow exceeds exhaust airflow.

Tool used to apply thermal compound.

Specific voltage output provided by a PSU.

Condition where exhaust airflow exceeds intake airflow.

Heat-conductive adhesive pad.

Power-supply output providing approximately 12 volts.

Approximately balanced intake and exhaust airflow.

Clip securing a heatsink to hardware.