Metal structure dissipating heat into surrounding air.

Storage combining magnetic disk and flash memory.

Graphics processing integrated into a processor or chipset.

Thermally conductive material improving heat transfer.

Hardware managing input/output device communication.

Memory controller built into the CPU.

Thin metal surface increasing cooling area.

Hardware increasing available input/output connections.

Network interface integrated into a motherboard or SoC.

Hardware securing a heatsink to a component.