hardware system

Processor installed into a removable socket.

Physical package enclosing a semiconductor chip.

Dual In-line Package with two rows of pins.

Small Outline Integrated Circuit package.

Quad Flat Package semiconductor package.

Land Grid Array package using flat contact pads.

Pin Grid Array package using pins for connections.

Ball Grid Array package using solder balls for connections.

Through-Hole Technology.

Surface-Mount Technology.