hardware system

Cooling accessory designed for electronic equipment.

Another term for thermal paste.

Semiconductor junction used to measure temperature.

Maximum specified CPU junction temperature.

Maximum or critical junction temperature specification.

Abbreviation for thermal design power.

Approximate heat output target for a component's cooling system.

Heat-transfer component attached to a hot device.

Array of thin metal fins increasing cooling surface area.

Flat heat-transfer device using vaporization and condensation.