hardware system

PCB surface finish using a thin silver layer.

PCB surface finish using a thin tin layer.

Organic solderability preservative PCB finish.

Hot-air solder-leveling PCB surface finish.

Electroless nickel immersion gold PCB finish.

Common fiberglass-reinforced epoxy PCB material.

Fully cured dielectric material forming a PCB layer.

Resin-coated material bonding PCB layers together.

Insulating material between PCB conductive layers.

Arrangement of conductive and insulating PCB layers.